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Synova Lgs Laser Edge Grinding Machines

2020-6-3First Laser Stencil LSS and Edge Grinding Systems LGS Relocation of international headquarters to Ecublens-Lausanne Switerland. 2001 Introduction of Laser Dicing Systems LDS for electronics and semiconductor industry and Laser Cutting Systems LCS 1997 Foundation of Synova S.A. Numerous awards for LMJ breakthrough invention. 1993

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Our products sell well all over the world.